Micro-cutting laser machine

The micro-cutting machine incorporates a last generation Laseo laser. This solution combines reliability and performance. Beam quality can achieve spot sizes smaller than 25 microns. This beam associated with design and movement of the XY greater precision, offers optimum cutting quality.

  • When tolerances are less than a few tens of microns, only a high precision tool will get a cut with a great finesse and quality edge. It’s for meeting such requirements as Laseo developing these own laser heads.

  • Machine de marquage laser et gravure. Bretagne

    Cutting metals, ceramics, silicon wafers, or produce micro-holes on these materials: everything becomes simple and easy. This operation is equivalent to a conventional numerical control furthermore this allows a faster handling.

Applications

  • Cutting pieces in very small tolerances.
    Micro-mechanical    Next
  • Cutting ceramic for HF electronic systems.
    HF electronic    Next

More...

Have you got questions? Would you like to know more? Contact us or download the commercial wafer