Specific Laser Systems on demand for Micro-machining

and Marking

 

 
Laseo, thanks to its Engineering departments, designs innovative laser solutions on your specific
requirements. Real experts in fully customized solutions for laser applications, our department
members listen and define with you the best laser architecture in terms of:
 
  • Marking speed
  • Objects dimensions
  • Materials
  • Precision and Tolerance
  • Cost

 

One of our realisations:

High speed multidiode and mutidirectionnal

plastic welding station

 
Well trained to project management, our team inform and communicate efficiently with you, thanks
to project reviews, until full objectives are reached. Laseo will lead your own laser applications
projects to success in :
  

 

 

 
 
 
  • Micro-cutting.
  • Micro-drilling.
  • Micro-welding.
  • Micro- cleaning.
  • Micro-brazing.
 

 

 

Configurations

Specifications

CW or pulsed Fiber laser @1.06 µm.

CW  CO2 laser @10.6 µm.

CW or pulsed Diode laser @ 808  or 915 nm.

Solid state laser Nd/Yag

 

 Fully customized specifications:

Fixed position /Optional translation or rotation unit.

Marking Head:

Focalization

Head speed

Spot diameter

Distance to the object

Marking area surface

Footprint

Optical output

Laser beam

 
 
 
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Incoming products

  • Plastic film microperforation systems
  • Packaging and stickers pre cutting system
  • Wide coarse micromachining 2D and 2,5 D laser system

                                   

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